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Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Price Stock Action
HSS25-B20-P51 CUI Devices
HEAT SINK, STAMPI...
$0.0620
RFQ
35,000
In-stock
Buy Now Get Quote
HSS28-B20-P39 CUI Devices
HEAT SINK, STAMPI...
$0.0900
RFQ
35,000
In-stock
Buy Now Get Quote
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