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日本語- Manufacturer：
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- CUI Devices (2)
- Attachment Method：
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- Material：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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11 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
|
2,938
In-stock
|
Buy Now Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ANOD AL... |
|
989
In-stock
|
Buy Now Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
|
250
In-stock
|
Buy Now Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
|
102
In-stock
|
Buy Now Get Quote | ||
|
|
ASSMANN WSW Components | HEAT SINK ANOD AL... |
|
1,363
In-stock
|
Buy Now Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
|
90
In-stock
|
Buy Now Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
|
89
In-stock
|
Buy Now Get Quote | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR TO22... |
|
240
In-stock
|
Buy Now Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
|
32
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.4W... |
|
35,000
In-stock
|
Buy Now Get Quote |
