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日本語- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,944
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
|
1,433
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
605
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Buy Now Get Quote |
