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日本語- Manufacturer：
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- Comair Rotron (1)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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2 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
-
|
35,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 13... |
-
|
35,000
In-stock
|
Get Quote |
