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日本語- Manufacturer：
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- CUI Devices (14)
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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15 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,893
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,944
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,262
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
3,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
2,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,870
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,215
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
4,828
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,606
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,977
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
646
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK FOR TO2... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
35,000
In-stock
|
Buy Now Get Quote |
