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日本語- Manufacturer：
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- CTS Corporation (1)
- CUI Devices (1)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
|
152
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X24.5M... |
|
100
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
|
524
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 42.5 X 42.5... |
|
65
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 42.5X42.5X1... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
CTS Corporation | HEAT SINK FORGED... |
|
35,000
In-stock
|
Buy Now Get Quote |
