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日本語- Manufacturer：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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2 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,606
In-stock
|
Buy Now Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
|
35,000
In-stock
|
Buy Now Get Quote |
