(1).png){kind=logo}
Русский язык
بالعربية
Türkçe 
Português
ภาษาไทย
Deutsch 
한어
Français
简体中文
日本語- Manufacturer：
-
- Comair Rotron (2)
- CUI Devices (1)
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
4 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
|
300
In-stock
|
Buy Now Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 19... |
-
|
35,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
-
|
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK SMT PKG |
-
|
35,000
In-stock
|
Get Quote |
