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日本語- Manufacturer：
-
- Aavid (2)
- CUI Devices (2)
- Ohmite (1)
- Attachment Method：
-
- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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5 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | HEATSINK TO-220 PO... |
|
3,681
In-stock
|
Buy Now Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
|
7,667
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid | HEATSINK TO-220 SO... |
|
2,436
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Buy Now Get Quote |
