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日本語- Manufacturer：
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- CUI Devices (2)
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Type：
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4 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
|
4,888
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
|
118,038
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
|
300
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
|
35,000
In-stock
|
Buy Now Get Quote |
