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日本語- Manufacturer：
-
- Ohmite (2)
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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6 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK AND CLI... |
|
426
In-stock
|
Buy Now Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
|
779
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
|
53
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
|
85
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
|
12
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
|
5
In-stock
|
Buy Now Get Quote |
