(1).png){kind=logo}
Русский язык
بالعربية
Türkçe 
Português
ภาษาไทย
Deutsch 
한어
Français
简体中文
日本語- Manufacturer：
-
- CUI Devices (4)
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
7 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
|
4,888
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
|
3,510
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
|
118,038
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,957
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
|
300
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
|
35,000
In-stock
|
Buy Now Get Quote |
