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日本語- Manufacturer：
-
- Aavid (1)
- CUI Devices (2)
- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,740
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 ST... |
|
751
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
433
In-stock
|
Buy Now Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid | HEAT SINK |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
-
|
35,000
In-stock
|
Get Quote |
