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日本語- Attachment Method：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Filter：
173 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.7W... |
|
1,923
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
15,288
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 6.8W... |
|
1,393
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
|
3,205
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
|
3,326
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
|
1,287
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
|
1,713
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,893
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
|
1,689
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
|
5,589
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
2,208
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,944
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
|
1,433
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,262
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
|
1,250
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
|
1,774
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
|
2,121
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
3,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
2,000
In-stock
|
Buy Now Get Quote |
