(1).png){kind=logo}
Русский язык
بالعربية
Türkçe 
Português
ภาษาไทย
Deutsch 
한어
Français
简体中文
日本語- Manufacturer：
-
- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
|
9,688
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,987
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
|
1,224
In-stock
|
Buy Now Get Quote |
